雷射劃線,雷射切割及電漿蝕刻切割製程用保護液
半導體晶圓雷射劃線, 雷射切割及電漿切割製程中可水洗式表面保護液
雷射切製程應用的可水洗式表面保護液
Temporary Surface Protection Coating Materials for Different Application
Material Characters:
Laser Scribing, Laser Dicing & Plasma Dicing Process at Semiconductor / LED / Optical Glass Application
- Laser Grooving (Laser Scribing)
- Lasser Dicing (Laser Cutting)
- Laser Grooving + Plasma Dicing
- Laser Dicing + Acid Etching
Material Characters:
- Pure Water Base Solution
- Easy to remove after process by hot / warm water
Laser Scribing, Laser Dicing & Plasma Dicing Process at Semiconductor / LED / Optical Glass Application
- Easy to coat on the wafer/material substrate
- Transparent material
- Easy to remove
- No debirs/partticle/burn mark after removal
Water Base Optical Transmission and Condutive Coating Material
- Screen Printing, Spraying or Roller Coating on the glass substrate
- Low temp baking materials
- Transparent materials
- Easy to remove by hot water after process